Ion Milling Etching System Configurator

      Home / Ion Milling Etching System Configurator
      Ion Milling Etching System Configurator
      Choose the maximum subsrate size. All substrates with sizes smaller than the maxium substrate size can be processed as well as very small samples on top of a carrier
      Choose the 75mm beam diameter for 4 inches maximum diameter substrates, the 100mm beam diameter for 6 inches maximum diameter substrates and the 160 mm beam diameter for 8 inches maximum substrate diameter. Each source has a power range of 100-1200eV, immersed filament neutralizer and a pneumatic shutter.
      RFICP ion beam sources are used for Reactive Ion Beam Etching. Choose the 100mm beam diameter for 4 inches maximum substrates diameter and the 200 mm beam diameter for 6 and 8 inches maximum substrate diameter. Each source has a power range of 100-1200eV, immersed filament neutralizer and a pneumatic shuter.
      The standard system includes substrate rotation with 0-20 RPM speed and tilt from +90° to -90°. Cooling is needed becasue high-energy ion bombardment transfers kinetic energy to the substrate, which increases its temperature significantly.
      He backside cooling
      This is an option to increase the heat transfer.
      The vacuum system uses an adequate turbomolecular pump, backed up with Dry Scroll pump and N2 slow vent.
      The standard Optical Emission Spectroscopy (OES) is used to measure the etching end point. Choose the SIMS end point detection for etching very thin films, for thin multilayer samples and for non uniform surfaces.
      Reactive Etching
      The standard system comes with an Ar MFC for the ion source. Additional MFCs for N2 and O2 gases, with SS gas lines and pneumatic shut-off valves can be added for reactive etching.
      Gridless End-Hall Ion Source
      For high current low energy beam surface cleaning
      Sputtering
      2” Magnetron gun with shutter and Ar MFC with SS gas lines for passivation layer deposition to protect freshly etched surface from oxidation
      Load Lock with linear drive, pneumatic isolation door, 70l/sec turbo pump backed up with dry pump and gauge, for single wafers or for wafer cassettes (for 8 wafers)
      Name
      Name
      First Name
      Last Name